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Third-generation semiconductors

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To develop third-generation semiconductors, Wuxi will support the National Innovation Center for Integrated Circuit Special Process and Packaging & Testing in the mass production of core technologies such as third-generation semiconductor monocrystalline material growth and ultra-hard crystal material cutting, as well as characteristic packaging technologies for third-generation semiconductors.

It will encourage leading manufacturing enterprises to actively layout wide-bandgap semiconductor wafer manufacturing process technology, comprehensively enhance the technical capability and expand the mass production scale of preparation technologies for SiC and GaN substrates and epitaxial monocrystalline materials. It will conduct research on technologies for narrow-band semiconductors like antimonides and ultra-wide bandgap semiconductor materials like Ga₂O₃ and AlGaN, innovate a batch of high-value third-generation semiconductor products, and build a new highland for the third-generation semiconductor industry.


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